How tin, silicon, rare gases, power and water flow up through qualified materials, ASML/ZEISS lithography, TSMC fabs and advanced packaging into deployable AI accelerator capacity — and where the real bottlenecks sit. Click any node or flow to inspect the dependency and its source.
Opinionated ranking by direct AI leverage, substitutability, single/limited-source exposure, and qualification difficulty. The real moat is purity and qualification: an available bulk commodity is not usable semiconductor-grade supply.